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agilent hsmx-c110/c170/c190/c191/c150 high performance chipled data sheet features ? high brightness alingap material ? small size ? industry standard footprint ? diffused optics ? top emitting or right angle emitting ? available in 3 colors (red, orange, amber) ? compatible with ir soldering ? available in 8 mm tape on 7" diameter reel ? reel sealed in zip locked moisture barrier bags applications ? lcd backlighting ? push button backlighting ? front panel indicator ? symbol indicator ? microdisplays ? small message panel signage these chipleds come either in two top emitting packages (hsmx-c170/c190/c191/c150) or in a side emitting package (hsmx-c110). the right angle chipleds are suitable for applications such as lcd back- lighting. the top emitting chipleds with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. in order to facilitate pick and place opera- tion, these chipleds are shipped in tape and reel, with 4000 units per reel for hsmx-c170/c190/ c191 and 3000 units per reel for hsmx-c110/c150. these packages are compatible with ir soldering process. description these chip-type leds utilize alu- minum indium gallium phosphide (alingap) material technology. the alingap material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. the available colors in this surface mount series are 592 nm amber, 605 nm orange, 626 nm red for as alingap and 631 nm red for ts alingap. all packages are binned by both color and intensity, except for red color. hsma-c110/c170/c190/c191/c150 hsml-c110/c170/c190/c191/c150 hsmc-c110/c170/c190/c191/c150 hsmz-c110/c170/c190
2 package dimensions 2.0 (0.079? 0.3 (0.012) 0.4 ?0.15 (0.016 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.4 ?0.15 (0.016 ?0.006) 1.4 (0.055) 0.62 (0.024) led die diffused epoxy pc board soldering terminal 1.25 (0.049) hsmx-c170 cathode line notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. hsmx-c190 1.6 (0.063? 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. hsmx-c191 1.6 (0.063? 0.3 (0.012) 0.3 ?0.15 (0.012 ?0.006) 0.3 (0.012) polarity cathode mark 0.6 (0.023) 0.3 ?0.15 (0.012 ?0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) polarity cathode line 1.5 (0.059) led die clear epoxy pc board soldering terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) cathode line hsmx-c110 3.2 (0.126 )
3 package dimensions, continued notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. device selection guide footprint as alingap as alingap as alingap ts alingap package (mm) [1,2] amber orange red red description 1.6 x 0.8 x 0.8 hsma-c190 hsml-c190 hsmc-c190 hsmz-c190 untinted, diffused 2.0 x 1.25 x 0.8 hsma-c170 hsml-c170 hsmc-c170 hsmz-c170 untinted, diffused 3.2 x 1.0 x 1.5 hsma-c110 hsml-c110 hsmc-c110 hsmz-c110 untinted, nondiffused 1.6 x 0.8 x 0.6 hsma-c191 hsml-c191 hsmc-c191 untinted, diffused 3.2 x 1.6 x 1.1 HSMA-C150 hsml-c150 hsmc-c150 untinted, diffused absolute maximum ratings t a = 25 c hsma-c110/170/190/191/150 hsml-c110/170/190/191/150 parameter hsmc-c110/170/190/191/150 hsmz-c110/170/190 units dc forward current [1,2] 25 25 ma power dissipation 60 65 mw reverse voltage (i r = 100 m a) 5 5 v led junction temperature 95 95 c operating temperature range C30 to +85 C30 to +85 c storage temperature range C40 to +85 C40 to +85 c soldering temperature see reflow soldering profile (figure 7 & 8) notes: 1. derate linearly as shown in figure 4. 2. drive currents above 5 ma are recommended for best long term performance. hsmx-c150 3.2 (0.126? 0.5 (0.020) 0.50 ?0.2 (0.020 ?0.008) 0.6 (0.024) polarity cathode mark 1.1 (0.043) 0.50 ?0.2 (0.020 ?0.008) 2.0 (0.079) 0.8 (0.031) led die diffused epoxy pc board soldering terminal 1.6 (0.063) cathode line notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified.
4 optical characteristics t a = 25 c luminous color, viewing luminous intensity peak dominant angle efficacy i v (mcd) wavelength wavelength 2 q 1/2 h v part @ 20 ma [1] l peak (nm) l d [2] (nm) degrees [3] (lm/w) number color min. typ. typ. typ. typ. typ. hsma-c110 as amber 28.5 95 595 592 130 480 hsma-c170/190/191/150 as amber 28.5 90 595 592 170 480 hsml-c110 as orange 28.5 95 609 605 130 370 hsml-c170/190/191/150 as orange 28.5 90 609 605 170 370 hsmc-c110 as red 28.5 95 637 626 130 155 hsmc-c170/190/191/150 as red 28.5 90 637 626 170 155 hsmz-c110 ts red 45 170 643 631 130 122 hsmz-c170/190 ts red 45 165 643 631 170 122 notes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics t a = 25 c forward voltage reverse breakdown capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 20 ma @ i r = 100 m a f = 1 mhz r q j-pin = ( c/w) parameter number typ. max. min. typ. typ. hsma-c110 1.9 2.4 5 45 600 hsml-c110 1.9 2.4 5 45 600 hsmc-c110 1.9 2.4 5 45 600 hsmz-c110 2.2 2.6 5 35 600 hsma-c170/190/191/150 1.9 2.4 5 45 300 hsml-c170/190/191/150 1.9 2.4 5 45 300 hsmc-c170/190/191/150 1.9 2.4 5 45 300 hsmz-c170/190 2.2 2.6 5 35 300
5 note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent rep- resentative for information on currently available bins. note: 1. bin categories are established for classification of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. orange color bins [1] dom. wavelength (nm) bin id min. max. a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 f 612.0 615.0 tolerance: 1 nm. yellow/amber color bins [1] dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 tolerance: 0.5 nm. light intensity (iv) bin limits [1] intensity (mcd) intensity (mcd) bin id min. max. bin id min. max. a 0.11 0.18 n 28.50 45.00 b 0.18 0.29 p 45.00 71.50 c 0.29 0.45 q 71.50 112.50 d 0.45 0.72 r 112.50 180.00 e 0.72 1.10 s 180.00 285.00 f 1.10 1.80 t 285.00 450.00 g 1.80 2.80 u 450.00 715.00 h 2.80 4.50 v 715.00 1125.00 j 4.50 7.20 w 1125.00 1800.00 k 7.20 11.20 x 1800.00 2850.00 l 11.20 18.00 y 2850.00 4500.00 m 18.00 28.50 tolerance: 15%. color bin limits [1]
6 figure 3. luminous intensity vs. forward current. figure 2. forward current vs. forward voltage. figure 4. maximum forward current vs. ambient temperature. figure 1. relative intensity vs. wavelength. 100 10 1 0.1 1.5 1.7 1.9 2.1 2.5 v f ?forward voltage ?v i f ?forward current ?ma ts alingap 2.3 as alingap 0 5 15 30 i f ?forward current ?ma 0 0.4 1.0 1.4 luminous intensity (normalized at 20 ma) 20 0.6 0.2 0.8 10 25 1.2 wavelength ?nm ts alingap red as alingap amber relative intensity 1.0 0.5 0 500 550 600 650 700 750 as alingap orange as alingap red 0 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 30 10 20 25 hsmx-c110 hsmx-c150/170/ 190/191
7 figure 5. relative intensity vs. angle for hsmx-c110. figure 6. relative intensity vs. angle for hsmx-c170, c190, c191, and c150. relative intensity ?% 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 relative intensity ?% 1.00 0 angle 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80
8 figure 8. recommended pb-free reflow soldering profile. figure 9. recommended soldering pattern for hsmx-c110. figure 10. recommended soldering pattern for hsmx-c170. figure 11. recommended soldering pattern for hsmx-c190 and c191. figure 12. recommended soldering pattern for hsmx-c150. 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) 0.9 (0.035) centering board 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) note: all dimensions in millimeters (inches). 217 ? max. 120 sec. 6 ?/sec. max. 3 ?/sec. max. 100 - 150 ? 255 ? (+5/-0) 60 to 150 sec. 10 to 20 sec. time temperature * the time from 25 ? to peak temperature = 6 minutes max. figure 7. recommended reflow soldering profile. 230? max. 10 sec. max. 4?/sec. max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec. m
9 figure 13. reeling orientation. figure 14. reel dimensions. 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00 (2.346 ?0.039) 20.20 min. ( 0.795 min.) 6 ps 178.40 ?1.00 (7.024 ?0.039) 3.0 ?0.5 (0.118 ?0.020) 4.0 ?0.5 (0.157 ?0.020) 5.0 ?0.5 (0.197 ?0.020) 13.1 ?0.5 ( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) cathode side printed label user feed direction note: all dimensions in millimeters (inches).
figure 15. tape dimensions. figure 16. tape leader and trailer dimensions. convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components. storage condition: 5 to 30?c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 +/C 5?c for 20 hours. end start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with components there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. minimum of 230 mm (9.05 inch) may consist of carrier and/or cover tape. notes: 1. all dimensions in millimeters (inches). 2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 10 8.00 ?0.30 (0.315 ?0.012) user feed direction dim. a (see table 1) 3.50 ?0.05 (0.138 ?0.002) 1.75 (0.069) dim. c (see table 1) 0.20 ?0.05 (0.008 ?0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 ?0.05 (0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a ?0.10 (?0.004) dim. b ?0.10 (?0.004) part number dim. c ?0.10 (?0.004) hsmx-c170 series 2.30 (0.091) 1.45 (0.057) 0.95 (0.037) hsmx-c190 series 1.80 (0.071) 0.95 (0.037) 0.87 (0.034) hsmx-c110 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c191 series 1.86 (0.073) 0.89 (0.035) 0.87 (0.034) hsmx-c150 series 3.50 (0.138) 1.88 (0.074) 1.27 (0.050) hsmx-c110 position in carrier tape dim. b (see table 1) dim. a (see table 1) r 1.0 ?0.05 (0.039 ?0.002)
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. obsoletes 5988-5891en april 23, 2004 5989-0519en

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